Semiconductor packaging material consists
of material used for protecting electronic components such as ICs and
semiconductors from external impact, corrosion and other similar
factors. These materials are used in conjunction with various other
advanced packaging technologies for packaging of integrated circuits and
semiconductors.
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Semiconductor packaging material can be
classified in eight sub-types which include bonding wires, organic
substrates, encapsulation resins, leadframes, die attach materials,
ceramic packages, solder balls and thermal interface materials amongst
others. The organic substrates accounts for the largest market share in
semiconductor packaging material. Organic substrates are extensively
used as base materials for semiconductor packaging. Bonding wires have
been used widely as packaging material for semiconductors, but recently
there has been a shift towards copper bonding wires for semiconductor
packaging.
The market for encapsulation resins is
expected to witness strong growth in the next few years since
encapsulation resins are relatively novel packaging materials. The
semiconductor packaging materials are application specific and available
across the globe. The various packaging technologies include GA, SOP,
QFN, DFN, QFA and similar others which generally depends on the end-use.
The market for semiconductor packaging
material is expected to witness strong growth in the next few years on
account of explosive growth in communication and mobile computing
devices such as tablets and smartphones across the globe. Growth in
mobile devices is also anticipated to drive the demand for wafer level
packages. With the continued growth in the mobile devices market the
market for semiconductor packaging materials is expected to witness
strong growth in the next few years.
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The increase in demand for semiconductor
packaging material is expected to be in line with the growth in the
electronics industry across the globe. The semiconductor packaging
material market is currently concentrated in Asia Pacific due to vast
electronic industry present in the region. With growing demand for
electronics and mobile communication devices the demand for
semiconductor packaging materials is also expected to witness robust
growth in the next few years.
Owing to the growing electronics industry
in Asia-Pacific region and increased demand for mobile computing
devices particularly in countries such as China, India Indonesia etc.
the demand for semiconductor packaging material is anticipated to
witness strong growth in these regions. Asia Pacific was the dominant
market for semiconductor packaging material followed by Europe and North
America. In North America, U.S was one of the largest markets for
semiconductor packaging material. U.S economy has been recently
recovered and has been close to pre-recession levels.
Looking forward, the packaging industry
in North America is expected to show stable growth in the next few
years, which in turn is anticipated to drive the semiconductor packaging material market
in this region. In Europe, Germany accounted for the largest market
share followed by Italy, France and the U.K. The semiconductor packaging
material market in North America and Europe is characterized by similar
market conditions. In the Rest of the World (RoW), especially in
countries such as Brazil, the market is expected to witness strong
growth on account of increased demand for semiconductors from the
electronics industry in this region.
Some of the major companies operating in
the global semiconductor packaging material market are Hitachi Chemical
Co. Ltd., BASF SE, Henkel AG & Company, Sumitomo Chemical Co. Ltd.,
Alent plc, and Kyocera Chemical Co. Ltd., among others.
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