The global market for thermoform packaging
is competitive in nature with a high level of fragmentation and is
expected to remain in the similar scenario in the next few years, states
a new market research study by Transparency Market Research. The
increasing number of applications and the growing focus of the key
players on innovations are projected to accelerate the growth of the
overall market in the next few years. In addition to this, the rising
number of research and development activities is estimated to enhance
the market penetration for the market players and further support the
growth of the market in the near future. The increasing mergers and
acquisitions is further predicted to offer growth opportunities in the
near future. Some of the key players operating in the thermoform
packaging market across the globe are Bemis Company, Inc., Display Pack
Inc., D&W FINE PACK, HUHTAMAKI GROUP, Sonoco Products Company.,
Anchor Packaging, Inc., Tray-Pak Corporation, Amcor Limited, and PACTIV
LLC.
As per the market research study by
Transparency Market Research, in 2017, the global market for thermoform
packaging was worth US$38,603.9 mn and is likely to reach a value of
US$57,615.9 mn by the end of 2024. The market is estimated to register a
healthy 5.90% CAGR between 2017 and 2024.
Asia Pacific to Offer Potential Growth Opportunities for Market Players
The global market for thermoform
packaging has been categorized on the basis of geography among which,
North America is holding a large share of the market and is projected to
remain in the leading position in the next few years. The presence of
several leading players is estimated to enhance the growth of the market
in the near future. On the other hand, Asia Pacific is likely to
exhibit a high growth rate in the next few years, thanks to the rising
contribution from India, China, and South Korea. In addition to this,
the growing demand for thermoform packaging from the food and beverages
sector and the rising urban population are further projected to
encourage the growth of the market in the near future.
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The global thermoform packaging market
has been categorized on the basis of packaging type into blister,
clamshell, skin, cups, and tubs. Among these, the blister segment is
expected to lead the global thermoform packaging market with a large
share in the next few years. The rising use of this packaging in the
pharmaceutical industry is one of the key factors that is estimated to
encourage the growth of this segment in the next few years. Furthermore,
advancements in the technology is projected to support the growth
throughout the forecast period.
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