Wafer
bonding system is a packing technology that is used on the
wafer-level. It is used for the packaging of microelectromechanical
systems (MEMS), optoelectronics, microelectronics, and
nanoelectromechanical systems (NEMS). A wafer bonder binds two wafers
together, typically by means of provisional bonding using a bonding
agent or by long-lasting bonding of the oxide film surfaces using a
self-bonding technique. The wafer bonding system contains fusion
bonding or direct bonding, eutectic bonding, anodic bonding, and
adhesive bonding. Direct bonding is mostly used for the development
of sensors, silicon on insulator (SOI) wafers, and actuators. Anodic
bonding is used to seal glass to silicon wafers in microfluidics and
electronics.
The persistent demand for wafer bonding systems is
majorly driven by the augmented production ramp in advanced CMOS
image sensors, MEMS devices, and advanced packing. In addition to
this, growing use of direct bonding for the manufacturing of Silicon
on Insulator (SOI) wafers, sensors and actuators is pushes the market
growth. The most attractive feature driving the growth of this
segment is the set of advantages offered by this process, such as
high bonding strength, high temperature stability, process
compatibility to semiconductor technology, and ability to bond in
vacuum or different atmospheric gases as well. However, limited
bonding and its strength, coupled with restrictions on post
processing after the bonding process are some major restraints which
might hamper the market growth.
The global wafer bonding systems market is
segmented on the basis of type, application, and geographical region.
On the basis of type, the wafer bonding systems market is segmented
into direct bonding, anodic bonding, solder/eutectic/ diffusion
bonding, glass-frit bonding, adhesive bonding, and others. By
application, the wafer bonding systems market can be segmented into
solar energy, opto-electronic, semiconductor, MEMS and others.
Semiconductor industry revealed the highest application of wafer
bonding technology. Semiconductor wafer bonding has been a subject of
discussion for many years and many inventions in the wafer bonding
methods have been seen in the recent period.
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Moreover, its major usage and high productivity in
designing the optoelectronic devices has pulled the technology under
the limelight. A steep growth in the demand for consumer electronics
such as smartphones and computers is expected to impact the identical
market segment in an optimistic manner. By geographical region, the
global wafer bonding system market is split up into North America,
Europe, Asia Pacific, Middle East & Africa and South America.
Europe, being a highly technically enhanced region, has always been a
leader when it comes to automotive and automobile industry. Moreover,
the continuous efforts in the automation of machinery and other such
devices has also generated an increased demand for semiconductor
based chips.
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