According to Transparency Market Research, the global E-beam wafer inspection system market is anticipated to flourish with a strong CAGR of 17.5% during forecast period from 2015 to 2025. ASML Holding N.V. (Netherlands), Hitachi Ltd. (Japan), KLA Tencor Corporation (The U.S.), NXP Semiconductors N.V. (Netherlands), Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan), Lam Research Corporation (The U.S.), Synopsys Inc. (The U.S.)Integrated Device Technology Inc. (The U.S.), Renesas Electronics Corporation (Japan), and Applied Materials Inc. (The U.S.) are some of the key companies dominating the global E-beam wafer inspection system market.
In year 2016, Asia pacific was evaluated to be the most dominant region among all, with 60% of market shares. Based on application, the defect imaging emerged as the largest application segment with a share of 38.5% in the market in year 2016. It is foreseen to remain prevailing through the duration of the forecast period.
The e-beam wafer inspection system market has immense development opportunities due to the rising appropriation of these systems by semiconductor manufacturers for their high-quality inspection. Since the semiconductor business is quickly developing and extending its development limit, there would be a massive need for more wafer inspection systems amid the forecast period. However, this market is exceptionally capital oriented and technologically advanced in nature.
Request Sample For More Information@
https://www.transparencymarketresearch.com/sample/sample.php?flag=S&rep_id=15884
Hermes Microvision is the most overwhelming player in the market and takes over the majority of the market share. Since the semiconductor business is developing and expanding, the demand for wafer inspection system is anticipated to increase amid the forecast period. This popularity for wafer inspection system will open up new opportunities in the market for manufactures, steering in new vendors, therefore swelling the competition.
Based on type, the global e-beam wafer inspection system market is segmented into less than 1 nm, 1 to 10 nm and more than 10 nm inspection resolution system. In 2016, e-beam wafer inspection system market was dominated by more than 10 nm wafer inspection systems, followed by the other two segments. However, during the forecast period the less than 1 nm segment will showcase a higher CAGR.
On the basis of application, the global e-beam wafer inspection system market has been segmented into defect imaging, lithographic qualification, bare wafer OQC/IQC, wafer dispositioning, reticle quality inspection, and inspector recipe optimization. Of these, defect imaging formed the largest application segment with a share of 38.5% in the market in 2016. It is expected to remain dominant through the course of the forecast period. Besides this, inspector recipe optimization followed by bare wafer OQC/IQC have emerged as the application segments exhibiting strong prospects for the market.
Request For Custom Research Report@
https://www.transparencymarketresearch.com/sample/sample.php?flag=CR&rep_id=15884
Asia Pacific Exhibits Most Lucrative Opportunities
Regionally, Asia Pacific, Europe, North America, Latin America, and the Middle East and Africa constitute the key segments in the global e-beam wafer inspection system market. Among these nations, Asia Pacific emerged dominant holding a little short of 60% share in the global market in 2016. In addition, North America and Europe have been demonstrating lucrative market opportunities over the last few years. These regions boast high investment in the research and development, which has led to extensive application of high quality wafers across diverse industries. With this, the use of e-beam wafer inspection system has also risen to detect any faults, thus giving significant impetus to the market.
Some of the leading players in the global e-beam wafer inspection system market are Hitachi Ltd. (Japan), ASML Holding N.V. (Netherlands), KLA Tencor Corporation (The U.S.), Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan), NXP Semiconductors N.V. (Netherlands), Lam Research Corporation (The U.S.), Renesas Electronics Corporation (Japan), Integrated Device Technology Inc. (The U.S.), Applied Materials Inc. (The U.S.), and Synopsys Inc. (The U.S.) among others.
0 comments:
Post a Comment