Semiconductor and IC Packaging Materials Market – Global Demand Analysis & Opportunity Outlook

The increasing adoption of integrated circuits (ICs) for various electronic devices is triggering the demand for semiconductor and IC packaging materials. They are used in the final stage of semiconductor device fabrication and are used to guard devices from corrosion and external impact. There are several types of materials used for semiconductor and IC packaging including organic substrates, solder balls, bonding wires, lead frames, die attach materials, encapsulation resins, thermal interface materials, and ceramic packages. Rapid advancements in technology are facilitating greater uptake of these packaging materials.

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The research report is an in-depth and professional study that aims to provide a 360-degree view of the global semiconductor and IC packaging materials market. It offers insights into the dynamics and trends of the market. It provides a detailed analysis of the competitive landscape of the market. It profiles key players in the market along with their business strategies, latest developments, revenue generation, and contact information. For lucid analysis, the report segments the market on the basis of geography, type, and technology. Each segment is meticulously studied in terms of both revenue and volume. The data pertaining to each segment and the overall market is depicted through graphical representation for a better understanding.

Global Semiconductor and IC Packaging Materials Market: Drivers and Restraints

The incessant research and development efforts by key players towards making the electronic packaging materials highly reliable are escalating the growth of the global semiconductor and IC packaging materials market. The increasing demand for consumer electronics is augmenting the market. The rising awareness about the usefulness of electronic packaging materials in a myriad of applications is also providing a significant boost to the growth of the market. On the other hand, the fluctuating prices of raw materials are adversely affecting the growth of the market. However, players are anticipated to tap immense potential in emerging economies in order to stimulate their revenue generation.

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Global Semiconductor and IC Packaging Materials Market: Geographical Segmentation

On the basis of geography, the global semiconductor and IC packaging materials market can be classified into Asia Pacific, Europe, North America, and Rest of the World. Asia Pacific will be a prominent market throughout the forecast period. The growth of the region is driven by rapid technological developments and the growing demand for advanced electronic packaging materials from end users.

Moreover, the high investments on electronics applications along with low-cost production, low labor cost, and easy availability of raw materials are contributing to the growth of the region. South Korea, Taiwan, Japan, and China will be major revenue contributors owing to the robust growth of the electronics industry. The Rest of the World region is expected to rise at a noteworthy CAGR during the same period, thanks to the promising conditions for semiconductor industries.

Global Semiconductor and IC Packaging Materials Market: Competitive Landscape

Product development is the main approach adopted by players in the global semiconductor and IC packaging materials market to consolidate their presence. Mergers and acquisitions are among the key strategies adopted by players to strengthen their presence in the market. Some of the prominent players in the market are Kyocera Chemical Co. Ltd., BASF SE, Toray Industries Corporation, Henkel Ag & Company, Alent Plc., Mitsui High-Tec Inc., LG Chemical Ltd., Tanaka Holdings Co. Ltd., Sumitomo Chemical Co. Ltd., and Hitachi Chemical Co. Ltd.

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Packaging Machinery Market – Company Analysis, SWOT, Marketing Strategy

Technological advancements and the emergence of innovative machinery have contributed extensively towards the development and growth of the global packaging machinery market. Packaging is one of the essential processes before presenting the final product to consumers. Some of the primary applications of packaging machinery are pharmaceuticals, food and beverages, chemicals, and personal care products. With innovations in the market, the application base is expected to expand, resulting in a high demand for packaging machinery across the globe. With these factors, the global market is anticipated to exhibit a healthy growth rate in the forecast period.

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The research study offers a detailed analysis of the global packaging machinery market. The growth drivers, current trends, opportunities, and challenges in the global market have been discussed at length in the scope of the study. In addition, the key segmentation, primary application, and the competitive scenario of the global packaging machinery market have been presented in the report to offer a strong understanding to readers and market players. The company profiles, business policies, financial overview, product portfolio, and the recent development have been included in the study.

Global Packaging Machinery Market: Drivers and Restraints

The growing demand for attractive and innovative packaging from the food and beverages industry is one of the important factors expected to fuel the growth of the global packaging machinery market in the next few years. In addition, the growing demand for multipacks, single-serve, and sustainable packaging is projected to accelerate the growth of the overall market. Furthermore, the rising popularity of robotic packaging is expected to contribute substantially towards the development of the global packaging machinery market.

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On the flip side, several issues related to the safety and hygiene of machinery parts and the growing focus on energy-efficient packaging machinery are anticipated to restrict the growth of the overall market throughout the forecast period. Nevertheless, the rising focus of companies to offer innovative packaging in order to attract a large number of consumers is predicted to offer lucrative opportunities for the leading players in the global packaging machinery market.

Global Packaging Machinery Market: Region-wise Outlook

From a geographical perspective, the global packaging machinery market can be classified into Europe, Asia Pacific, North America, and the Rest of the World. As per the research report, North America is expected to witness substantial growth throughout the forecast period and account for a key share of the overall market. The high growth of this region can be attributed to the presence of a large number of players operating in the market.

Furthermore, the leading players in the North America packaging machinery market are emphasizing on research and development activities to offer effective solutions for consumers. Moreover, the rising number of mergers and acquisitions is expected to encourage the growth of the market throughout the forecast period. On the other hand, Asia pacific is expected to witness significant growth in the near future, thanks to the increasing number of players investing in this region and the growing demand for packaging machinery across diverse industries.

Key Players Mentioned in the Research Report are:

The global market for packaging machinery is extremely competitive and fragmented in nature with a presence of a large number of players. To attain a leading position in the market, the prominent players are focusing on new product development and innovations. Some of the leading players operating in the packaging machinery market across the globe are Crown Holdings Incorporated, Bosch Packaging Technology, Coesia, Mamata Enterprises, Dover, Tetra Pack, Nordson, Barry-Wehmiller, Krones, Multivac, Illinois Tool Works, and Reynolds Group. With the rising number of players, the competition is expected to get intense in the next few years.

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Top Insights on the Semiconductor Packaging Material Market

Semiconductor packaging material consists of material used for protecting electronic components such as ICs and semiconductors from external impact, corrosion and other similar factors. These materials are used in conjunction with various other advanced packaging technologies for packaging of integrated circuits and semiconductors.

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Semiconductor packaging material can be classified in eight sub-types which include bonding wires, organic substrates, encapsulation resins, leadframes, die attach materials, ceramic packages, solder balls and thermal interface materials amongst others. The organic substrates accounts for the largest market share in semiconductor packaging material. Organic substrates are extensively used as base materials for semiconductor packaging. Bonding wires have been used widely as packaging material for semiconductors, but recently there has been a shift towards copper bonding wires for semiconductor packaging.

The market for encapsulation resins is expected to witness strong growth in the next few years since encapsulation resins are relatively novel packaging materials. The semiconductor packaging materials are application specific and available across the globe. The various packaging technologies include GA, SOP, QFN, DFN, QFA and similar others which generally depends on the end-use.

The market for semiconductor packaging material is expected to witness strong growth in the next few years on account of explosive growth in communication and mobile computing devices such as tablets and smartphones across the globe. Growth in mobile devices is also anticipated to drive the demand for wafer level packages. With the continued growth in the mobile devices market the market for semiconductor packaging materials is expected to witness strong growth in the next few years.

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The increase in demand for semiconductor packaging material is expected to be in line with the growth in the electronics industry across the globe. The semiconductor packaging material market is currently concentrated in Asia Pacific due to vast electronic industry present in the region. With growing demand for electronics and mobile communication devices the demand for semiconductor packaging materials is also expected to witness robust growth in the next few years.

Owing to the growing electronics industry in Asia-Pacific region and increased demand for mobile computing devices particularly in countries such as China, India Indonesia etc. the demand for semiconductor packaging material is anticipated to witness strong growth in these regions. Asia Pacific was the dominant market for semiconductor packaging material followed by Europe and North America. In North America, U.S was one of the largest markets for semiconductor packaging material. U.S economy has been recently recovered and has been close to pre-recession levels.

Looking forward, the packaging industry in North America is expected to show stable growth in the next few years, which in turn is anticipated to drive the semiconductor packaging material market in this region. In Europe, Germany accounted for the largest market share followed by Italy, France and the U.K. The semiconductor packaging material market in North America and Europe is characterized by similar market conditions. In the Rest of the World (RoW), especially in countries such as Brazil, the market is expected to witness strong growth on account of increased demand for semiconductors from the electronics industry in this region.

Some of the major companies operating in the global semiconductor packaging material market are Hitachi Chemical Co. Ltd., BASF SE, Henkel AG & Company, Sumitomo Chemical Co. Ltd., Alent plc, and Kyocera Chemical Co. Ltd., among others.

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Smart Earbuds: A Looming Threat to the Hearing Aid Market

A smart earbud is a technically advanced in-ear electronic device which is designed for various purposes including wireless communication, music listening, fitness tracking, medical monitoring and more. Smart earbuds are light in weight, durable and have a longer battery life. A smart earbud provides a good quality sound in a light and convenient form factor. A smart earbud can not only help boost hearing and nullify disturbing noise, but also helps in making phone calls and listening to high quality music hands-free. Furthermore, smart earbuds are equipped with noise cancellation technology, which bring about sound that can balance background noise, such as distracting blather in crowded places.

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In addition, microphones present in each smart earbud captures incoming audio and letting in sounds that people want to hear. With the help of a smart earbud people can augment the hearing in a noisy social environment. Furthermore, smart earbud can help users control precisely what they want to hear in the world around them. Moreover, a smart earbud comes with an application that can save various hearing settings, which is personalized for specific environments.

For instance, people may want to hear as much of their surroundings as they can while riding a car or a bicycle, but quash background noise while in a hotel or in a cafe. A smart earbud gets connected to a smartphone with the help of a Bluetooth technology. Smart earbuds can act as a wireless earpieces, so users can listen to music, podcasts or audio-books in a stereo and engage with various voice-enabled applications. With the help of a smart earbud, users can answer the phone calls and starts or stops audio with a simple tap on an earbud.

The major factors strengthening the smart earbuds market growth is the fitness tracking capability of these devices. Moreover, the consumers are getting inclined towards the smart earbud to boost up listening experience along with the other features including noise filtering and cancelling. Due to advanced features of a smart earbud that enables the user to track heart rate, measured covered distance and calculate the number of calories burned during a workout, the market is witnessing an increasing demand for the biometric sports tracking smart earbud. Various prominent companies are launching their smart earbud with innovative features to attract the consumers.

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For instance, LG electronics launched its first smart earbud named the heart rate earbud, which measures the heart rate, speed, steps and calories and provide audio feedback of the workout. A smart earbud can track oxygen rate, energy spent and oxygen saturation along with the speed, distance, time, cadence, heart rate and location in real time.

Factors that can retrain the growth of a smart earbuds market is the inability of a smart earbud to capture data as often as one can with other forms of fitness tracker devices such as smart wristbands. Moreover, smart earbud comes with a high cost as compare to conventional earbuds. A smart wristband benefits from their ability to be always on, in that they can collect biometric data while sleeping, running and swimming. However, wearing earbuds is not always viable in these situations.

Increasing innovations with respect to smart earbud technology by various prominent companies are expected to create novel opportunities for a smart earbuds market. For instance, Apple incorporation is working on a patent named a smart monitoring system, which is going to be popular among active users of hearing technology. They are likely going to make a big push into monitoring and measuring biometrics via earbuds.

Furthermore, filled in early 2014, Samsung’s hybrid hearing devices patent technology could allow users to use their Samsung device as a controller for amplifying sounds via air conduction or bone conduction. Wearhaus Audio Technologies also come up with a smart earbud with total 5 million color customization and other features including precision-tuned sound and patented wireless audio sharing technology

A smart earbuds market can be segmented on the basis of smart earbud type and region. By type, a smart earbuds market can be segmented as wired & wireless smart earbud. Geographically, a smart earbuds market is segmented into North America, Europe, Middle East & Africa, Asia-pacific and South America. North America & Europe are expected to lead the smart earbuds market due to increasing research & development activities with respect to smart eabud by prominent companies such as Apple Incorporation, Doppler Labs Incorporation and more. However, due to the increasing consumer demand for the fitness tracking hearable, Asia-Pacific is expected to grow at a significant rate in the coming years.

Some of the Key players in a smart earbuds market are Bragi, Doppler Labs Inc., Wearhaus Audio Technologies, Sony Mobile Communications In.,Jabra, SAMSUNG, LG Electronics, Motorola Mobility LLC, Nuheara, LifeBEAM Inc.

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Active, Smart and Intelligent Packaging Market – Driven by the Sophisticated and Advanced Transport Facilities Available

With the retail industry growing at a rapid pace, the need for attractive and advanced is also increasing with every passing day. Due to the ever increasing urban population and changing lifestyle trends, the demand for ready-to-eat, frozen, and packaged is increasing extensively across the globe. The supply of frozen foods, meat products, vegetables, and fruits is surpassing boundaries, thus giving regional markets a global exposure. As a result of this, the demand for specialty packaging has also increased over the last couple of years and is expected to stay the same in the years to come.

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Active, smart, and intelligent packaging is used by manufacturers for retaining the nutritional value and freshness of the product within and at really competitive prices. The global trade of active, smart, and intelligent packaging is expected to be relatively driven by the sophisticated and advanced transport facilities available. The demand for active, smart, and intelligent packaging is maximum from the consumer goods, food and beverages, and pharmaceuticals industry keeping in mind the sensitivity of various products and the publicity needed in these industries.

However, the growth of the market is likely to be restrained by the extensively high cost of implementation due to the huge money being invested in the research and development of better products. To address this issue, the key players are focusing on product development with minimum cost incurred and ensured quality.

Global Active, Smart, and Intelligent Packaging Market: Overview

Packaging of a product not only ensures a safe and secure reach to the end-user, they also significantly affect the way the product is presented to the consumers from the marketing perspective. New technologies such as intelligent packaging, active, smart packaging, and modified atmosphere packaging are replacing traditional methods such as canning. Advanced packaging interacts internally (active packaging) as well as externally (intelligent packaging) with the environment and enhances the visual appeal of the products. Besides this, smart and active packaging also ease the process of bulk transportation. With the technological advancements, innovative packaging alternatives are now available for the manufacturers to innovate their consumer outreach and gain market share. The food industry in particular, which is currently at its peak, is the primary driver in the global active, smart, and intelligent packaging, besides the growing requirement of packaging that can more efficiently control gas and moisture.

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Based on several factors, some of which are mentioned below, this report on global active, smart, and intelligent packaging market is projected for a healthy double digit growth rate during the forecast period. The report also profiles some of the key players who are currently leading this market, and aims to serve as a guide for the players to make more informed choices. Active packaging, modified atmosphere, and intelligent packaging technology are of the technology segments of this market, whereas application segment can include seafood, meat and poultry, soup, confectionaries, dairy products, and fruits and vegetables.

Global Active, Smart, and Intelligent Packaging Market: Trends and Opportunities

Some of the emerging packaging products are advanced time-temperature monitors, antimicrobial packaging, and smartphone-enabled interactive packaging products. Most of these products are anticipated to develop further during the forecast period and pave way for manufacturers to impress their consumers. Due to the escalating demand for packaged food, such as ready-to-cook, from the urban population across the globe, coupled with increasing food safety concerns that is quickly becoming a norm for several industries, the market for active, smart, and intelligent packaging is expected to stay in good stead. This market is also expected to grow on account of increasing need for to retain freshness and nutritional value of the products, at competitive prices.

In particular, the report anticipates intelligent packaging market to expand faster as products such as time-temperature indicators and smart labels become common. The report also suggests that active packaging demand will be driven by the growth in gas scavenger products, which are benefitting from the development of more advanced technology and growing preference toward foods with fewer additive.

Global Active, Smart, and Intelligent Packaging Market: Region-wise Outlook

Currently, the region of North America serves the maximum demand for active, smart, and intelligent packaging, as far as geographical segmentation of this is concerned. Owing to factors such as stringent legislations regarding food and beverage packaging in the country-wide markets of the U.S., and Canada, the demand from North American region will sustain during the forecast period. However, the demand from the region of Asia Pacific which resides several emerging economies, is also expected to swell considerably in next few years.

Companies Mentioned in the Research Report

Active, smart, and intelligent packaging makes for an evolving market wherein new and technologically advanced products are of great essence. The key players in this market, such as Amcor Ltd., Graham Packaging Company Inc., Landec Corp., Ball Corp., Timestrip, plc, VIP Packaging, Sealed Air Corp., SYSCO Corp., Mitsubishi Gas Chemical, notice this requirement as are continuously investing on research and development to gain ground over their competitors.

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Baby Food Packaging Market – Key Drivers, Applications and Future Developments

Baby food packaging is of paramount importance for consumers to safeguard the quality of the packaged food. The baby food packaging market has evolved from the use of glass jars to plastics and other materials that are easy to store and are low in cost. The packaging of baby food is available in various types such as folding cartons, metal cans, thin wall containers, stand-up pouches that are suitable for different food types such as dried, milk formula, prepared, and other baby food. The demand for stand-up pouches is on the rise owing to their long shelf life.

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The report presents an in-depth analysis of the development aspects of the global baby food packaging market for the 2016-2024 period. Besides this, technological and design innovations in the packaging of baby food are discussed at length in this report. The research report has been prepared after an extensive research phase to present the growth trajectory of the global baby food packaging market until the end of the forecast period in 2024. The report provides a granular view of the market segments along with the factors influencing them. In this report, the current competitive structure is analyzed based on which the changing competitive hierarchy is presented factoring in market fluctuations.

Global Baby Food Packaging Market: Drivers and Restraints 

The increasing demand for stand-up pouches and thin wall containers owing to their hygienic, lightweight, safe, reusable, and easy to carry nature are some of the primary factors driving the global baby food packaging market. The freshness of food and long shelf life are added advantages of these packaging fuelling the growth of the baby food packaging market. However, the presence of BPA (Bisphenol A) in the plastic used for baby food packaging is harmful to infants and has been banned by the governments of the U.S., Canada, and several European countries.

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Nevertheless, research and development for the introduction of biodegradable materials such as paper will open growth opportunities to the growth of this market. The increasing preference of teenagers for foods packed in microwaveable plastic tubs and pouches is benefitting the growth of this market. Moreover, the increasing demand for packaged food from rural areas is also expanding the growth opportunities of the global baby food packaging market.

Global Baby Food Packaging Market: Regional Outlook 

The report segments the global baby food packaging market into North America, Asia Pacific, Europe, and Rest of the World. Amongst these, Asia Pacific is emerging as a significant market for baby food packaging due to the increasing use of packaged food products by the urban population. The rising disposable income and busy lifestyle are also adding to the growth of the baby food packaging market in Asia Pacific.

Companies Mentioned in the Report

The report presents the competitive landscape of the market, wherein the top players are profiled for their key business attributes. Some of the top companies operating in the global baby food packaging market are Bericap India Pvt Ltd., Hindustan National Glass & Industries Ltd., Tata Tinplate Company of India (TCIL), Cascades Inc., FPC Flexible Packaging Corp., Hood Packaging Corp, AptarGroup Inc., Bemis Company Inc., MeadWestvaco Corporation, Essel Propack Limited, IYC Ltd Paperboards and Specialty Papers Division (PSPD), Tetra Pak India Pvt Ltd, Celplast Ltd, Pretium Packaging LLC, Ball Corporation, Winpak Ltd, and Rexam Inc.

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Medical Devices Packaging Market – Europe is the Leading Consumer

Medical device packaging market is expected to expand at an above average growth over the forecast period. Western Europe, the U.S. and Japan are the largest consumers with more than half of the world consumption owing to advanced technological capabilities essential for the medical devices production.

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Growing healthcare industry is expected to drive the medical devices market which in turn affects the medical device packaging demand. However, healthcare cost reduction in the major markets as well as cost sensitiveness due to rising completion in the medical devices market might hamper the market growth. Growth in regions other than Western Europe, the U.S. and Japan is expected to present future prospects for the medical device packaging market.

Containers are the dominant product types of medical device packaging and expected to remain the largest segment over the forecast period. Other product types include pouches, trays, blister packs, clamshell packs and vials. Stringent government regulations and strict industry standards are expected to further enhance the market demand. Improved strength, barrier properties and puncture resistance have added to the attractiveness of pouches for small to medium sized packages. Multiple compartment trays and clamshell trays are other types which are gaining popularity attributed to lower risk of infection spreading and staff errors during the organization of products.

Europe is the leading consumer followed closely by North America. Major demand in Europe is generated from Western Europe where most of the major consumers such as GE Healthcare, Phillips and Siemens Healthcare among others are located. Asia Pacific has emerged as the fastest growing market led by India and China owing to expansion and stricter regulations for medical products industry in the region.

Some of the players in the medical device packaging market include Amcor Limited, Chesapeake Limited, DuPont, Klöckner Pentaplast Group, MeadWestvaco Corporation, Mitsubishi Chemical Holdings Corporation and 3M Company among others.

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