Anti-counterfeit Automobile Packaging Market – Positive Outlook for Industry Opportunities & Trends

Counterfeiting or forging is a worldwide phenomenon which not only affects the growth of industries but also affects the end-users of their products. Companies are becoming progressively conscious of the potential negative effects of counterfeit parts in their supply chain, which affect the sales revenue of the company. Besides, since the quality of the counterfeit product does not match with that of the original product, it also affects the brand image of the company. The forged components are so well developed that they are undetectable in normal conditions and thereby find application in critical areas, such as in automobile spare parts and maintenance. The usage of such components results in poor product quality and thus increases consumer safety concerns, which leads to the deterioration of the brand image of the concerned company.

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Counterfeiting affects the company’s gross revenue and results in immense long term damage to its credibility in the market. In the automobile and aerospace industries, the costs incurred due to usage of forged and counterfeit parts are estimated to be in multi-millions.

The anti-counterfeit automobile packaging technology has emerged as an efficient solution for detecting counterfeit products globally. The automobile industry is severely affected by counterfeit products as they are easily available in the local market. The Motor & Equipment Manufacturers Association (MEMA) conducted a survey in 2013 regarding the losses suffered by the global automobile industry due to counterfeiting. The results of the survey estimated losses close to US$ 12 Bn, which obviously is a significant amount.

The global anti-counterfeit automobile packaging market is projected to become a multi-billion industry, growing significantly over the forecast period of 2016-2024. Innovative technologies are coming into market for tracking and authentication of the original products, which are easy as well as very efficient in functioning. Their increasing adoption in the market, in turn, is propelling the demand for anti-counterfeit automobile packaging globally. Use of product level RFID technologies is one of the most significant factors expected to drive the growth of the overall anti-counterfeit automobile packaging market.

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Rising consciousness among consumers about the forged or counterfeit products and anti-counterfeit technologies is also affecting the market positively. Increasing government regulations and efforts taken in order to eliminate the usage of counterfeit products in the automobile industry is also increasingly driving the companies to invest in advanced anti-counterfeit technologies. The synergistic approach of industrial players, along with various government organizations, is expected to provide a platform for the growth and development of the global anti-counterfeit automobile packaging market over the forecast period.

Apart from the above beneficial properties, there are several others factors restraining growth of the market for anti-counterfeit automobile packaging. Among these, high costs of anti-counterfeit setups and their impact on the product distribution system are the major factors expected to restrain growth of the anti-counterfeit automobile packaging market over the forecast period.

The global anti-counterfeit automobile packaging market is segmented on the basis of technology and regions. On the basis of technology, the market is segmented into authentication technology and track and trace packaging technology. The authentication technology segment is further sub-segmented into ink & dyes, holograms, watermarks, and taggants. On the other hand, the track and trace packaging technology segment is sub-segmented into barcode technology and RFID technology.

On the basis of geography, the global anti-counterfeit automobile packaging market is segmented into seven main regions, namely North America, Latin America, Western Europe, Eastern Europe, Asia Pacific excluding Japan, the Middle East & Africa, and Japan. Currently, North America accounts for the largest share of the global anti-counterfeit automobile packaging market, followed by the Europe market. The Asia-Pacific anti-counterfeit automobile packaging market is also expected to expand at a significant growth rate over the forecast period.

Some of the key players in the global anti-counterfeit automobile packaging market are FUJIFILM Holdings America Corporation, Alien Technology Corp., AlpVision, Avery Dennison Corp., Datamax-O’Neil (Honeywell), Giesecke & Devrient (G&D), and IAI Industrial Systems.

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Wafer Level Package Dielectrics Market – Global Demand Analysis & Opportunity Outlook 2024

Wafer Level Package (WLP) is a type of packaging used in the semiconductor industry for the packaging of Integrated Circuits (ICs) as it is very fragile in nature and highly susceptible to contamination, which can lead to improper working of the IC. WLP finds application in the ICs used in portable consumer electronic devices; for instance, smart phones. Increasing consumer demand for technologically advanced mobile devices that are capable of performing an array of functions in a single small-end product is a major factor propelling demand for wafer level packaging technology as compared to the conventional mode of packaging in case of semiconductors, thus boosting growth of the market for wafer level package dielectrics further. Comparatively, the low cost associated with the wafer level packaging as compared to the conventional packaging technology used in case of semiconductor packaging is also a major factor expected to boost growth of the market for wafer level package dielectrics over the forecast period.

The wafer level package dielectrics market is expected to expand at a healthy CAGR over the forecast period, and the major driving factor responsible for growth of the wafer level package dielectrics market is the rising demand for compact electronic devices with high performance and cost effective packaging in the semiconductor packaging industry. In case of conventional packaging, such as die level packaging, with the variation in size of the ICs, the cost of packaging becomes more as compared to the production cost of the ICs. On the contrary, wafer level packaging is much more cost-efficient as compared to the conventional packaging or the production cost of the ICs.

The technological advancements in IC design & production are also, to an extent, propelling growth of the wafer level package dielectrics market currently. The wafer level packaging technology has certain perks over the traditional packaging technology, such as minimized electricity consumption and long battery life in case of mobile phones, and its compactness helps manufacturers design and develop ultra-thin mobile phones. However, fluctuations in some of the physical properties of the technology, such as the coefficient of thermal expansion of the materials of wafer with respect to the material of ICs, are considered as a drawback of the wafer packaging technology, which in turn might restraint growth of the market for wafer level package dielectrics.

The global wafer level package dielectrics market is segmented on the basis of type of wafer level packaging, application, and region. On the basis of type, the global market for wafer level package dielectrics is segmented into FOWLP (Fan-Out Wafer Level Package), FIWLP (Fan-in Wafer Level Package), FIWLCSP (Fan-in Wafer Level Chip Scale Package), flip chip, and 3DFOWLP. On the basis of applications, the global market for wafer level package is segmented into consumer electronics, automotive, aerospace, defense, and healthcare.

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On the basis of geography, the global rigid plastic packaging market is segmented into seven key regions, namely North America, Latin America, Western Europe, Eastern Europe, Asia Pacific, Japan, and the Middle East & Africa. Among the aforementioned regions, the Asia-Pacific market is projected to grow at a promising CAGR, which is attributed to the increase in demand for smart phones globally. For instance, recently, India become the second largest user of smart phones globally, beating the U.S. This is turn is expected to drive growth of the wafer level package dielectrics market in the country. Moreover, the presence of leading semiconductor manufacturers, such as Taiwan Semiconductor Manufacturing, among others, is expected to have a positive effect on growth of the wafer level package dielectrics market in APEJ over the forecast period.

Some of the major players identified in the global wafer level package dielectrics market include ChipMOS TECHNOLOGIES INC., STATS ChipPAC Ltd., IQE PLC, Amkor Technology Inc., TriQuint Semiconductor Inc., Deca Technologies, KLA-Tencor Corporation, Siliconware Precision Industries Co. Ltd., China Wafer Level CSP Co. Ltd., and Jiangsu Changjiang Electronics Technology Co. Ltd.

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Anti-counterfeit Food Packaging Market – Business Strategies, Revenue Generation, Market Shares & Latest Development

The malpractice of introducing counterfeit products is severely affecting the global food industry, causing legitimate and well-established brands tangible and intangible losses. Such unethical practices affect the revenue of food companies and also creates distrust towards brands among end-users. Major players in the global food industry are constantly striving to remove counterfeit products from their supply chain, as these affect their sales revenue, thus impacting profits. Besides this, poor quality of counterfeit products affects respective brand image of various companies and also raises severe health concerns among consumers. Well-industrialised counterfeit products are so well packaged that normal detection techniques are unable to effectively spot any difference during regular inspection, and these products are sent to the retail market for sale. Each year, major players in the global food industry suffers losses, estimated in hundreds of million dollars, due to the presence of counterfeit products in the market.

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Anti-counterfeit food packaging technology has emerged in the recent past, and has been proving to be an efficient and important solution against counterfeiting globally. Since food products are available easily at all levels of the market, the food industry is most vulnerable. Increasing cases of counterfeiting in the food industry are forcing manufacturers to use anti-counterfeit food packaging at various levels, and this is expected to increase growth of the concerned market significantly over the forecast period.

The global anti-counterfeit food packaging market is projected to account for significantly high revenue by end of 2024. Several efficient and innovative technologies are fast emerging in the market for validation of original products, which are gaining popularity among manufacturers globally. In addition, increasing use of highly efficient RFID technologies is one of the most significant factors expected to drive overall growth of the anti-counterfeit food packaging market globally.

Rising health awareness among consumers, understanding of the hazards associated with forged or counterfeit products, and emergence of anti-counterfeit technologies are factors expected to fuel growth of the global anti-counterfeit food packaging market over the forecast period. Besides, increasing government regulations for eliminating counterfeit food products from local markets is also encouraging global companies to invest more in advanced anti-counterfeit technologies.

Intense capital expenditure for anti-counterfeit technology setups and their impact on the product distribution system and supply chain network are factors expected to hamper growth of the anti-counterfeit food packaging market.

The global anti-counterfeit food packaging market is segmented on the basis of technology and regions. The technology segment is categorized into authentication packaging technology and track and trace packaging technology. The authentication technology is further sub-segmented into ink & dyes, holograms, watermarks and taggants. The track and trace packaging technology is sub-segmented under barcode technology and RFID technology.

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Pharmaceutical Cartridges Market To Hold a High Potential for Growth by 2026

There is high demand for pharmaceuticals drug packaging products that are safer and protects pharmaceutical drugs from contamination. Earlier, prefilled syringes were the popular and preferred solution of the drug practitioners but the users often met with accidents due to the breaking of the needle sticks. Thus, there is requirement for packaging products that are safer and user friendly. Since, cartridges do not contain any needle, they eliminate every possibility of any injury. Furthermore, cartridges are highly suitable for the temperature sensitive drugs due to their preservative properties. Thus, they are a safe pharmaceutical packaging solution for the users.

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The glass is the most prominently used material for the manufacturing of the pharmaceutical cartridges. The segment holds the major share among the material type segment. This is due to the chemical resistivity of the glass, as glass is highly resistive to pharmaceutical drugs for longer period of time. Type 1 borosilicate glass holds higher market share from its counterparts.

The key trend in the pharmaceutical cartridges market is that the manufacturers are shifting their preference from glass to plastics pharmaceutical cartridges. This is due to the structural issues which occur with the usage of glass for a long period of time. The glass starts degrading from the edges and mixes with the drug solution. Further, glass pharmaceutical cartridges requires higher protection while shipping and usage, due to high chances of breakage f material. Thus, to overcome these issues the global manufacturers started using COC and COP material for manufacturing of pharmaceutical cartridges.

The global market for pharmaceutical cartridges is segmented into material type and capacity type. On the basis of material type, the global pharmaceutical cartridges market is segmented into glass and plastic.  The glass segment is further segmented into Type I, Type II, and Type III glass type. The plastic segmented is segmented into cyclic olefin copolymer (COC), cyclic olefin polymer (COP), polyethylene (PE) and polypropylene (PP).

The key restating factor for the growth of the pharmaceutical cartridges market is consumers focus towards alternative drugs such as Homeopathy and Ayurveda. Increasing incidence of chronic diseases is attributed to sedentary lifestyle and significant increase in geriatric population. However, over the last few years, there has been an increase in healthcare awareness. As such, complementary and alternative medicines is gaining wide prominence among users. From past few years, alternative treatment such as Homeopathy and Ayurveda captured greater share of overall healthcare treatment market. The major reason for increase in the preference for the Ayurveda drug is due to its zero side effects.

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Underfill Material Market: Automotive and Military End-users Fueling Demand

An up to date business and commerce publication by Transparency Market Research (TMR) has detected that the global underfill materials market is largely consolidated among a handful of players, and forecasted the competitive landscape to remain limited within the major players despite a few new entrants making a mark. The analyst of the TMR report has notified that as of 2017, Henkel and NAMICS Corporation were the two leading companies, accounting for more than half of the total shares in the global underfill materials, although H.B Fuller, Nordson Corporation, and Epoxy Technology Inc. also held a prominent position.

The position of strength of these key players is a reflection of their brand value, which has been built over the years. For instance, Henkel offers packaging level underfill materials that have been designed to deliver reliability while meeting stringent testing requirements and ensuring Pb-free compatibility. The company offers a range of products from materials with incredibly long working lives, low Potassium/Copper (K/Cu) die, high thermal Underfills, and Snapcure processing alternatives. NAMICS Corporation, on the other hand, offers a wide range of flip chip underfills that find applications in graphic devices, LSI, and CPU. Apart from the producers, the value chain of the underfill material market also includes raw material suppliers such as Admatechs Company Limited and semiconductor assemblers and packagers.

As per the projections of the TMR report, the demand in the global underfill materials market will be expanding at a considerable CAGR of 8.3% during the forecast period of 2017 to 2024. Revenue-wise, the market is estimated to attain a valuation of 448.3 mn by the end of 2024. Going forward, in addition to developing a brand image and enhancing product portfolio, some of the key strategies anticipated by these players to stay ahead of the curve are: capacity and geographical expansion, new product development, and mergers and acquisitions.

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Underfills Materials Market Segmented Based on Product and Application

Rising demand for mobile electronic products, increasing demand from the military and aerospace end-users, growing popularity of copper pillars, development of low-k underfill by several companies, and entrance of new players with niche technology are some of the key factors driving the demand in the global underfill materials market. In addition to that, the analysts have notified for a few trends such as transition towards cost effective underfills and consolidations by major players by the means of M&A. Conversely, downward pricing pressure and high cost of research and development activities for the development of new products are challenging the underfill materials market from achieving greater peaks.

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Unit Drug Dose Delivery System Market to Record Ascending Growth by 2025

According to the latest market report published by Transparency Market Research titled ‘Unit Drug Dose Delivery System Market: Global Industry Analysis and Forecast 2017-2025’, global unit drug dose delivery system market, valuated at US$ 26,339.0 Mn in 2017 in terms of revenues, is expected to witness a modest CAGR of  5.8% during the forecast period (2017-2025). The global unit drug dose delivery system market has witnessed solid growth during the past few decades, owing to the increasing need for accurate dosing. Ease of storage, accurate dosing, and ease of disposal are some of the prominent factors which are expected to fuel the market of global unit drug dose delivery system.

The global unit drug dose delivery system market by packaging type has been segmented into blister packaging, pre fillable syringes and cartridges, vials & ampoules, and others (pouches and sticks). By material type, global unit drug dose delivery system market is segmented into plastic, glass, and others. Plastic segment is expected to dominate the market throughout the forecast period with an estimated market share of over 59% by 2025 end, whereas glass segment is expected to register a value of US$ 8,184.2 Mn during the forecast period.

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Plastic segment is further segmented into PE, polystyrene, polycarbonate, polypropylene, poly vinyl chloride (PVC), and PET. Polyethylene segment is further sub segmented into low density polyethylene (LDPE) and high density polyethylene (HDPE). Glass segment is further sub segmented into type-1, type-2 and type-3. By product form, the unit drug dose delivery system market is segmented into solid, liquid and powder. Among the product form, solid segment attained a value share of over 40% in 2017 and is expected to dominate the market during the forecast period as well. Powder segment is expected to be the most attractive throughout the forecast period, having a considerable value share of 35.4% in 2017, which is likely to reach up to 36.7% by 2025 end.

Among geographic market segments, the APAC region is anticipated to lead the global unit drug dose delivery system market, during the forecast period. APAC region is projected to register the highest CAGR of 7.3%, during the forecast period, by value.

The market players that have been profiled in the report include Amcor Limited, Bemis Company, Inc., Wipak Group, Schott AG., Nipro Corporation, Gerresheimer AG, West Pharmaceutical Services, Inc., R-Pharm Germany GmbH, Agrado S.A, Constantia Flexibles Group GmbH, Stevanato Group,  Klockner Pentaplast Group.,  Catalent, Inc.,., Huhtamaki Oyj.,  Omnicell, Inc., Piramal Glass Limited, O.Berk Company, LLC, and SGD Pharma .

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APEJ to Record Fastest Expansion in Global Merchandising Units Market, notes TMR

Manufacturers of merchandising units are focusing on the provision of variety solutions to their customers as a top-priority, along with benefits such as high appeal toward consumer interest, reduced prices, and facilitated logistics. Merchandising units manufacturers are also concentrating on retaining aesthetic appeal of their products while keeping efficiency intact. Corrugated cardboard units are being developed in order to offer retailers and brand owners with low-cost flexibility and versatile range of aesthetics.

For example, “Pimp My Display” concept of STI Group enables retailers and brand owners dress up their universal stands in distinctive manners, for communicating local promotions and brand-specific concepts. Key shareholders of the global merchandising units market, as identified by a new Transparency Market Research report, include STI Group, Cheshire Packaging, Tilsner Carton Company, Panda Inspire, Acryl Design Ltd, Print & Display, Expanda Stand, Boxes and Packaging, and Creative Displays Now.

The report evaluates the global market for merchandising units to ride on a stable CAGR during the forecast period, 2017 to 2026. Worldwide sales of merchandising units are poised to surpass US$ 600 Mn in revenues by 2026-end.

Easy-to-use merchandising units have gained immense popularity among retailers worldwide, often delivered to stores that are prefilled with products, thereby enabling stands to be set up in simple steps. Additional features provided such as integrated casters and wheeled pallets have further facilitated placing of merchandising units in these stores, thereby driving their adoption. Demand for merchandising units is further being propelled by their provision of easy tailoring of mix & quantity of prefilled products on these units, staying abreast with requirements of individual retail stores or sales channels.

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Over the years, merchandising units have emerged as essential combination of displays and packaging solutions, with design focus directed toward optimization of handling, distribution, and merchandising enormous product quantities in retail stores. Manufacturers generally concentrate on designing modular merchandising units, utilizing corrugated boxes to keep their environmental footprint in check. Optimization of logistic operations is the main objective of these designs, implying extensions of shelf-ready packaging.

Europe to Remain at Forefront of Global Merchandising Units Market

In terms of revenues, Europe will continue to spearhead the global market for merchandising units, closely trailed by North America and Asia-Pacific excluding Japan (APEJ). However, revenues from merchandising units’ sales in APEJ are set to record a relatively faster increase through 2026. Sales in Middle-East & Africa are also expected to exhibit an impressive expansion, albeit revenues from this region’s market will remain sluggish in the period of forecast.

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