The presence of a large number of international and local companies is boosting competition in theglobal atomic layer deposition (ALD) equipment market. As per a new study by Transparency Market Research (TMR), the competition prevailing in the market is expected to intensify further between 2016 and 2024. As of 2015, ASM International N.V., Applied Materials, Inc., and Tokyo Electron Ltd. cumulatively held a share of 58.9% in the global market. Of these, ASM International N.V. emerged as the top player, accounting for over 28% of the global ALD equipment market in 2015. Rivalry among key players in terms of product development and technology and product upgrades is expected to intensify during the forecast period.
“Due to the recent advancements in the atomic layer deposition technology, the use of ALD equipment has considerably increased in the nanotechnology sector,” says a lead analyst at TMR. TMR expects applications of ALD equipment as manipulation and fabrication tools in nanotechnology to rise further in the short term. “Growing concerns pertaining to carbon emissions have accelerated investment in the R&D of photovoltaics. Due to the increasing research and development activities, the use of ALD as a PV manufacturing method has substantially expanded,” adds the analyst. This rising demand for photovoltaic cells, combined with rapid advancements witnessed in PV technology, will subsequently augment sales of ALD equipment in the forthcoming years.
In the forthcoming years, the market will also gain momentum from the increasing demand for copper deposition equipment in memory devices. On the flip side, stringent regulatory controls on exports and high initial investment required to procure ALD equipment will limit their sales globally. The absence of skilled human resource and the slow deposition rate of ALD equipment are also likely to curb growth to some extent.
Nevertheless, with the proliferation of ALD across flexible electronics, hydrophobic coatings, and electronic textiles, ALD equipment manufacturers are expected to witness positive opportunities to sustain their growth-run. Furthermore, leading players are also expected to capitalize on the increasing application of ALD across power and energy storage devices.
Download Brochure@
Based on type, the aluminum oxide ALD segment accounted for 37% of the global ALD equipment market in 2015. Aluminum oxide, being a highly stable and robust material, is extensively used in research for a plethora of applications in micro and optoelectronics. By application, the semiconductors and electronics segment accounted for the largest share in the market. Demand for ALD equipment for semiconductor processing is high because of the increasing use of the technology in the manufacture of smartphones and other electronic gadgets.
Rapid Industrialization in Asia Pacific Fuels Demand for ALD Equipment
Regionally, Asia Pacific emerged at the fore of the global atomic layer deposition equipment market, with a share of 57.2% in 2015. The region owes its dominance to the rapid expansion of its industrial sector, which has been translating into high sales prospects for ALD equipment. Furthermore, companies operating in APAC are also capitalizing on the easy availability of cheap skilled labor and favorable government subsidies.
TMR says that the sales of ALD equipment in Asia Pacific will rise at an impressive CAGR of 29.9% between 2016 and 2024. According to the report, the global atomic layer deposition equipment market was valued at US$875.0 mn in 2015 and is anticipated to reach US$8.58 bn by 2024, at a CAGR of 29.4% from 2016 to 2024.
